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Spraying rice with 250 mg/L ethephon solution once at the 4-leaf stage and once at the 6-leaf stage, or spraying with 500 mg/L ethephon solution once at the 4-leaf stage, can reduce seedling height by about 10%, effectively prevent seedling failure after transplanting, promote early root development, rapid greening, early and abundant tillering, prevent lodging in the later stages of the plant, and significantly increase yield.

At the 6-leaf stage, spraying once with a 400 mg/L ethephon solution can reduce plant height, ear position, and center position in corn varieties, shortening and thickening basal internodes, promoting root development, improving stabilization, preventing lodging, promoting early maturity, and increasing yield.

During the vigorous growth period, spraying the entire plant with a 1000–1500 mg/L ethephon solution can effectively control excessive growth, resulting in thicker stems, larger and thicker leaves, and improved lodging resistance.

Spraying the leaves with a 2000 mg/L ethephon solution at the early jointing stage can shorten internodes, reduce plant height by about 20 cm, enhance lodging resistance, and thus increase yield.

Spraying with a 300–500 mg/L ethephon solution when the plant has 9–12 leaves can make the plant shorter and sturdier, promote fruit ripening, and increase yield.

Applying a 1%–6% ethephon solution to the wounds can improve lacquer production and increase lacquer yield.

Applying a 10% ethephon solution can increase the diameter and number of resin ducts in wounds and expand their distribution range, thereby increasing benzoin yield.